Publikationen

Photomask Technology 2011: 2^nd place at best paper award

More than monitoring: advanced lithographic process tuning 

G. R. Cantrell, Jo Alvin Dumaya, Christian Bürgel, Axel Feicke, Martin Häcker, Clemens Utzny 

 

Photomask Technology 2018: Best Poster 

Multiple exposure on single blank for electron-beam writer characterization 

André Eilert, Michael Finken, Christian Bürgel, Mark Herrmann, Ronald Hellriegel, Rico Nestler, Oliver Löffler, Frank Hübenthal, Rico Büttner, Katja Steidel 

Proc. SPIE. 10810, 

 

EMLC 2017: Best Paper 

Splendidly blended: a machine learning set up for CDU control 

Folgen

Proceedings Paper + Presentation | 26 September 2019

Loading effect correction set up by supplementing CD measurement analysis with machine learning

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11148, Photomask Technology 2019

KEYWORDS: Convolution, Critical dimension metrology, Environmental sensing, Etching, Machine learning, Manufacturing, Photomasks, Quality measurement, Scanning electron microscopy, Semiconductors

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Proceedings Paper | 29 August 2019

Necessity is the mother of invention: support vector machines for CD control

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11177, 35th European Mask and Lithography Conference (EMLC 2019)

KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Machine learning, Optical inspection, Performance modeling, Process control, Solids, Visualization

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Proceedings Paper | 27 June 2019

The study of relationship between defect sensitivity and inspectability on EUV masks with 19x nm mask inspection

Masashi Yonetani, Karen Badger, Jed Rankin, Shinji Akima, Yusuke Toda, Itaru Yoshida, Masayuki Kagawa, Takeshi Isogawa, Yutaka Kodera, Jan Heumann, Anka Birnstein

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Defect detection, Defect inspection, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Opacity, Optical inspection, Photomasks, Signal detection

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Proceedings Paper | 27 June 2019

Deal gently with the bird you are trying to catch: small scale CD control with machine learning

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Detection and tracking algorithms, Machine learning, Optical inspection, Process control, Solids, Visualization

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Proceedings Paper | 27 June 2019

Lifetime test on EUV photomask with EBL2

Chien-Ching Wu, Markus Bender, Rik Jonckheere, Frank Scholze, Herman Bekman, Michel van Putten, Rory de Zanger, Rob Ebeling, Jeroen Westerhout, Kyri Nicolai, Jacqueline van Veldhoven, Véronique de Rooij-Lohmann, Olaf Kievit, Alex Deutz

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Oxidation, Photomasks, Reflectivity, Ruthenium, Scanners

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Proceedings Paper + Presentation | 1 May 2019

Experimental Investigation of a high-κ reticle absorber system for EUV lithography

Jo Finders, Robbert de Kruif, Frank Timmermans, Jara García Santaclara, Brid Connely, Markus Bender, Frank Schurack, Takahiro Onoue, Yohei Ikebe, Dave Farrar

Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X

KEYWORDS: Absorption, Diffraction, Distortion, Etching, Extreme ultraviolet lithography, Photomasks, Refractive index, Reticles, Scanners, Tantalum

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Proceedings Paper + Presentation | 26 September 2019

Loading effect correction set up by supplementing CD measurement analysis with machine learning

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11148, Photomask Technology 2019

KEYWORDS: Convolution, Critical dimension metrology, Environmental sensing, Etching, Machine learning, Manufacturing, Photomasks, Quality measurement, Scanning electron microscopy, Semiconductors

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Proceedings Paper | 29 August 2019

Necessity is the mother of invention: support vector machines for CD control

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11177, 35th European Mask and Lithography Conference (EMLC 2019)

KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Machine learning, Optical inspection, Performance modeling, Process control, Solids, Visualization

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Proceedings Paper | 27 June 2019

The study of relationship between defect sensitivity and inspectability on EUV masks with 19x nm mask inspection

Masashi Yonetani, Karen Badger, Jed Rankin, Shinji Akima, Yusuke Toda, Itaru Yoshida, Masayuki Kagawa, Takeshi Isogawa, Yutaka Kodera, Jan Heumann, Anka Birnstein

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Defect detection, Defect inspection, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Opacity, Optical inspection, Photomasks, Signal detection

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Proceedings Paper | 27 June 2019

Deal gently with the bird you are trying to catch: small scale CD control with machine learning

Christian Bürgel, Martin Sczyrba, Clemens Utzny

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Data centers, Data modeling, Data processing, Detection and tracking algorithms, Machine learning, Optical inspection, Process control, Solids, Visualization

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Proceedings Paper | 27 June 2019

Lifetime test on EUV photomask with EBL2

Chien-Ching Wu, Markus Bender, Rik Jonckheere, Frank Scholze, Herman Bekman, Michel van Putten, Rory de Zanger, Rob Ebeling, Jeroen Westerhout, Kyri Nicolai, Jacqueline van Veldhoven, Véronique de Rooij-Lohmann, Olaf Kievit, Alex Deutz

Proc. SPIE. 11178, Photomask Japan 2019: XXVI Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Oxidation, Photomasks, Reflectivity, Ruthenium, Scanners

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Proceedings Paper + Presentation | 1 May 2019

Experimental Investigation of a high-κ reticle absorber system for EUV lithography

Jo Finders, Robbert de Kruif, Frank Timmermans, Jara García Santaclara, Brid Connely, Markus Bender, Frank Schurack, Takahiro Onoue, Yohei Ikebe, Dave Farrar

Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X

KEYWORDS: Absorption, Diffraction, Distortion, Etching, Extreme ultraviolet lithography, Photomasks, Refractive index, Reticles, Scanners, Tantalum

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Proceedings Paper + Presentation | 26 March 2019

Towards ultimate image placement accuracy for EUV mask writing with pattern shift process

Vadim Sidorkin, Stephan Zimmermann, Stefan Proske, Michael Finken, G. Cantrell, Markus Bender

Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X

KEYWORDS: Electron beam lithography, Extreme ultraviolet, Metrology, Photomasks, Reticles

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Proceedings Paper + Presentation | 26 March 2019

Towards ultimate image placement accuracy for EUV mask writing with pattern shift process

Vadim Sidorkin, Stephan Zimmermann, Stefan Proske, Michael Finken, G. Cantrell, Markus Bender

Proc. SPIE. 10957, Extreme Ultraviolet (EUV) Lithography X

KEYWORDS: Electron beam lithography, Extreme ultraviolet, Metrology, Photomasks, Reticles

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Proceedings Paper + Presentation | 12 November 2018

Mask process correction validation for multi-beam mask lithography

Ingo Bork, Peter Buck, Christian Bürgel, Bhardwaj Durvasula, Stefan Eder-Kapl, Peter Hudek, Michal Jurkovic, Jan Klikovits, Elmar Platzgummer, Jed Rankin, Rao Nageswara, Murali Reddy, Christoph Spengler

Proc. SPIE. 10810, Photomask Technology 2018

KEYWORDS: Cadmium, Calibration, Data modeling, Double patterning technology, Etching, Lithography, Photomasks, Scanning electron microscopy, SRAF, Vestigial sideband modulation

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Proceedings Presentation | 12 October 2018

Minimizing tone reversal during 19x nm mask inspection: PMJ18 Best Paper (Conference Presentation)

Masashi Yonetani, Kazunori Seki, Karen Badger, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera

Proc. SPIE. 10810, Photomask Technology 2018

KEYWORDS: Defect detection, EUV optics, Extreme ultraviolet, Extreme ultraviolet lithography, Inspection, Lithography, Optical inspection, Photomasks, Semiconducting wafers, Wafer-level optics

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Proceedings Paper + Presentation | 3 October 2018

WEREWOLF: sensitivity optimization for early 7 nm EUV masks using an optical 19x nm inspection system

Karen Badger, Masashi Yonetani, Yusuke Toda, Masayuki Kagawa, Takeshi Isogawa, Jan Heumann

Proc. SPIE. 10810, Photomask Technology 2018

KEYWORDS: Defect detection, Defect inspection, EUV optics, Extreme ultraviolet, Inspection, Inspection equipment, Optical inspection, Photomasks, Polarization, Semiconducting wafers

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Proceedings Paper + Presentation | 3 October 2018

Multiple exposure on single blank for electron-beam writer characterization

André Eilert, Michael Finken, Christian Bürgel, Mark Herrmann, Ronald Hellriegel, Rico Nestler, Oliver Löffler, Frank Hübenthal, Rico Büttner, Katja Steidel

Proc. SPIE. 10810, Photomask Technology 2018

KEYWORDS: Critical dimension metrology, Critical dimension scanning electron microscopy, Electron beam lithography, Electron beams, Electrons, Materials processing, Optical proximity correction, Photomasks, Photoresist processing, Scatterometry, Thin films

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Proceedings Paper | 3 October 2018

Applying MPC for EUV mask fabrication

Dai Tsunoda, Yohei Torigoe, Yutaro Sato, Masakazu Hamaji, Gek-Soon Chua, Christian Bürgel

Proc. SPIE. 10810, Photomask Technology 2018

KEYWORDS: Calibration, Critical dimension metrology, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, Mask making, Photomasks

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Proceedings Paper | 19 September 2018

Deposition durability of e-beam mask repair

Thorsten Krome, Christian Holfeld, Tim Göhler, Pavel Nesladek

Proc. SPIE. 10775, 34th European Mask and Lithography Conference

KEYWORDS: Binary data, Chemistry, Deep ultraviolet, Mask cleaning, Opacity, Ozone, Phase shifts, Photomasks, Printing, Semiconducting wafers

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Proceedings Paper | 19 September 2018

Machine learning methods applied to process qualification

Mark Herrmann, Stefan Meusemann, Clemens Utzny

Proc. SPIE. 10775, 34th European Mask and Lithography Conference

KEYWORDS: Critical dimension metrology, Data modeling, Distance measurement, Machine learning, Performance modeling, Photomasks, Principal component analysis, Statistical analysis, Statistical modeling

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Proceedings Paper + Presentation | 2 August 2018

A holistic metrology sensitivity study for pattern roughness quantification on EUV patterned device structures with mask design induced roughness

Shimon Levi, Ishai Swrtsband, Vladislav Kaplan, Ilan Englard, Kurt Ronse, Bogumila Kutrzeba-Kotowska , Gaoliang Dai, Frank Scholze, Kenslea Anne, Hayley Johanesen, Laurens Kwakman, Igor Turovets, Maxim Rabinovitch, Sven Krannich, Nikolai Kasper, Brid Connolly, Romy Wende, Markus Bender

Proc. SPIE. 10585, Metrology, Inspection, and Process Control for Microlithography XXXII

KEYWORDS: Atomic force microscopy, Etching, Extreme ultraviolet, Metrology, Photomasks, Semiconducting wafers, Signal processing, Transmission electron microscopy

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Proceedings Paper | 12 June 2018

Minimizing "Tone Reversal" during 19x nm mask inspection

Kazunori Seki, Karen Badger, Masashi Yonetani, Anka Birnstein, Jan Heumann, Takeshi Isogawa, Toshio Konishi, Yutaka Kodera

Proc. SPIE. 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Deep ultraviolet, Defect detection, Defect inspection, EUV optics, Extreme ultraviolet, Inspection, Opacity, Photomasks, Polarization

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Proceedings Paper | 12 June 2018

EUV capping layer integrity

Pavel Nesládek, Jonas Schmidt, Thorsten Krome

Proc. SPIE. 10807, Photomask Japan 2018: XXV Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Atomic force microscopy, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, Manufacturing, Photomasks, Reflectivity, Ruthenium, Ultraviolet radiation

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Proceedings Paper | 20 March 2018

Hot spot variability and lithography process window investigation by CDU improvement using CDC technique

Thomas Thamm, Bernd Geh, Marija Djordjevic Kaufmann, Rolf Seltmann, Alla Bitensky, Martin Sczyrba, Aravind Narayana Samy

Proc. SPIE. 10587, Optical Microlithography XXXI

KEYWORDS: Light scattering, Lithography, Logic devices, Photomasks, Reticles, Scanners, Scattering, Source mask optimization

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Proceedings Paper | 28 September 2017

Splendidly blended: a machine learning set up for CDU control

Clemens Utzny

Proc. SPIE. 10446, 33rd European Mask and Lithography Conference

KEYWORDS: Artificial intelligence, Critical dimension metrology, Evolutionary algorithms, Internet, Machine learning, Manufacturing, Photomasks, Process control, Semiconductors, Statistical analysis

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Proceedings Paper | 28 September 2017

Half circle chrome loss by electrochemical effects

1. Caspary, S. Jähne, P. Nesladek, M. Kristlib, L. Bahrig, A. Feicke, M. Kaiser, J. Lorbeer, T. Wandel

Proc. SPIE. 10446, 33rd European Mask and Lithography Conference

KEYWORDS: Electrochemical etching, Phase shifts, Photomasks

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Proceedings Paper | 13 July 2017

EUV repair process optimization and integration

Pavel Nesládek, Alexander Lajn, Thorsten Schedel, Markus Bender

Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Critical dimension metrology, Etching, EUV optics, Extreme ultraviolet, Lithography, Manufacturing, Mirrors, Optics manufacturing, Photomasks, Ruthenium

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Proceedings Paper | 13 July 2017

Effects of hard mask etch on final topography of advanced phase shift masks

Olga Hortenbach, Haiko Rolff, Alexander Lajn, Martin Baessler

Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Atomic force microscopy, Chromium, Critical dimension metrology, Diffractive optical elements, Etching, Molybdenum, Oxygen, Phase shifts, Photomasks, Reactive ion etching, Scanning electron microscopy

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Proceedings Paper | 13 July 2017

Etch bias inversion during EUV mask ARC etch

Alexander Lajn, Haiko Rolff, Richard Wistrom

Proc. SPIE. 10454, Photomask Japan 2017: XXIV Symposium on Photomask and Next-Generation Lithography Mask Technology

KEYWORDS: Chemistry, Etching, Extreme ultraviolet, Extreme ultraviolet lithography, High volume manufacturing, Oxygen, Photomask technology, Photomasks, Photoresist processing, Polymers, Process control

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© 2010 Society of Photo-Optical Instrumentation Engineers (SPIE)

© 2010 Photomasks Japan

© 2010 Society of Photo-Optical Instrumentation Engineers (SPIE)